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W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics

Sanhuang electronics (Hong Kong) Co., Limited
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    Buy cheap W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics from wholesalers
     
    Buy cheap W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics from wholesalers
    • Buy cheap W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics from wholesalers

    W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics

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    Brand Name : Winbond Electronics
    Model Number : W631GG8KB-11
    Price : Based on current price
    Payment Terms : T/T
    Supply Ability : In stock
    Delivery Time : 3-5 work days
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    W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics

    Product Details


    GENERAL DESCRIPTION

    The W631GG6KB is a 1G bits DDR3 SDRAM, organized as 8,388,608 words x 8 banks x 16 bits. This device achieves high speed transfer rates up to 1866 Mb/sec/pin (DDR3-1866) for various applications. W631GG6KB is sorted into the following speed grades: -11, -12, 12I, 12A, 12K -15, 15I, 15A and 15K. The -11 speed grade is compliant to the DDR3-1866 (13-13-13) specification. The -12, 12I, 12A and 12K speed grades are compliant to the DDR3-1600 (11-11-11) specification (the 12I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C). The -15, 15I, 15A and 15K speed grades are compliant to the DDR3-1333 (9-9-9) specification (the 15I industrial grade which is guaranteed to support -40°C ≤ TCASE ≤ 95°C).

    FEATURES

     Power Supply: VDD, VDDQ = 1.5V ± 0.075V
     Double Data Rate architecture: two data transfers per clock cycle
     Eight internal banks for concurrent operation
     8 bit prefetch architecture
     CAS Latency: 6, 7, 8, 9, 10, 11 and 13
     Burst length 8 (BL8) and burst chop 4 (BC4) modes: fixed via mode register (MRS) or selectable On The-Fly (OTF)
     Programmable read burst ordering: interleaved or nibble sequential
     Bi-directional, differential data strobes (DQS and DQS#) are transmitted / received with data
     Edge-aligned with read data and center-aligned with write data
     DLL aligns DQ and DQS transitions with clock
     Differential clock inputs (CK and CK#)
     Commands entered on each positive CK edge, data and data mask are referenced to both edges of a differential data strobe pair (double data rate)
     Posted CAS with programmable additive latency (AL = 0, CL - 1 and CL - 2) for improved command, address and data bus efficiency
     Read Latency = Additive Latency plus CAS Latency (RL = AL + CL)
     Auto-precharge operation for read and write bursts
     Refresh, Self-Refresh, Auto Self-refresh (ASR) and Partial array self refresh (PASR)
     Precharged Power Down and Active Power Down

    Specifications

    AttributeAttribute Value
    ManufacturerWinbond Electronics
    Product CategoryMemory ICs
    Series-
    PackagingTray Alternate Packaging
    Package-Case78-TFBGA
    Operating-Temperature0°C ~ 95°C (TC)
    InterfaceParallel
    Voltage-Supply1.425 V ~ 1.575 V
    Supplier-Device-Package78-WBGA (10.5x8)
    Memory Capacity1G (128M x 8)
    Memory-TypeDDR3 SDRAM
    Speed933MHz
    Format-MemoryRAM

    Descriptions

    SDRAM - DDR3 Memory IC 1Gb (128M x 8) Parallel 933MHz 20ns 78-WBGA (10.5x8)
    DRAM Chip DDR3 SDRAM 1Gbit 128Mx8 1.5V 78-Pin WBGA
    Quality W631GG8KB-11 IC DRAM 1GBIT PAR 78WBGA Winbond Electronics for sale
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